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Hybrid Semiconductor 3D Nanoscale Patterning Method Using Superionic Solid State Stamping (S4) and Metal Assisted Etching (MacEtch) Various high aspect ratio semiconductor 3D nanostructures have begun to have profound effect on the design and performances of many types of devices, including... Read More Various high aspect ratio semiconductor 3D nanostructures have begun to have profound effect on the design and performances of many types of devices, including batteries, solar cells, detectors and thermoelectrical systems. Photolithography is typically used for the fabrication of these nanostructures, which is an extremely expensive technique, especially for large area applications. This invention provides a new method for processing three dimensional (3D) periodic nanostructure patterns in semiconductor materials including Si, III-V, II-VI and other types of semiconductors. Details This invention describes the fabrication technique used to manufacture 3D periodic nanostructure patterns in semiconductor materials. The technique is non-lithographic and combines two fabrication techniques; superionic solid state stamping (S4) and metal assisted etching (MacEtch). S4 is a unique electrochemical stamping process, used to pattern artibrary nanoscale shapes in metallic materials (down to 15nm range) using a solid electrolyte stamp in which metal ions are immobilized. MacEtch is then used to selectively remove portions of the semiconductor, assisted by metal catalyst under a wet etching environment. Using these two methods together opens up the nanostructure world for use in large area applications. Applications 3D nanostructure fabrication will prove useful in the areas of: Batteries Photovoltaics Thermoelectrics Benefits Powerful hybrid fabrication technique (top-down approach) Fast (30 sec to a few minutes, depending on depth desired) Performed at room temperature Non-lithographical Low-Cost Scalable Efficient Fabricate both linear and annular patterns (can make circular patterns) High aspect ratios (resolution like no other technique, features down to 15nm range)
Extreme Miniaturized 3D Spiral On-Chip Inductors, Transformers, and Transmission Lines Inductors Researchers at the University of Illinois have developed a novel design of on-chip inductors using multiple turn microtubes based on stain-... Read More Inductors Researchers at the University of Illinois have developed a novel design of on-chip inductors using multiple turn microtubes based on stain-induced self-rolled-up nanotechnology. This technology would allow nearly 200x smaller footprint compared to conventional planar inductors while achieving significant performance improvements in all aspects. Transformers Researchers at the University of Illinois have developed a novel design of on-chip transformers using multiple turn microtubes based on strain-induced, self-rolled-up nanotechnology. This design allows a nearly 12x smaller footprint compared to conventional planar transformers, while achieving significant performance improvements. Transmission Lines Researchers at the University of Illinois have developed a novel design of on-chip transmission lines using multiple turn microtubes based on strain-induced, self-rolled-up nanotechnology. This design allows transmission lines to operate at Terahertz frequencies with significant performance improvements and reductions in interference and loss.
Self-Rolled up On-Chip Transformer for Extreme Size Reduction and Performance Enhancement Inductors Researchers at the University of Illinois have developed a novel design of on-chip inductors using multiple turn microtubes based on stain-... Read More Inductors Researchers at the University of Illinois have developed a novel design of on-chip inductors using multiple turn microtubes based on stain-induced self-rolled-up nanotechnology. This technology would allow nearly 200x smaller footprint compared to conventional planar inductors while achieving significant performance improvements in all aspects. Transformers Researchers at the University of Illinois have developed a novel design of on-chip transformers using multiple turn microtubes based on strain-induced, self-rolled-up nanotechnology. This design allows a nearly 12x smaller footprint compared to conventional planar transformers, while achieving significant performance improvements. Transmission Lines Researchers at the University of Illinois have developed a novel design of on-chip transmission lines using multiple turn microtubes based on strain-induced, self-rolled-up nanotechnology. This design allows transmission lines to operate at Terahertz frequencies with significant performance improvements and reductions in interference and loss.
On-Chip Terahertz Cozxial Transmission Line Based on Local Stress controlled Self-Rolled-up SiNx Nanomembrane Technology Inductors Researchers at the University of Illinois have developed a novel design of on-chip inductors using multiple turn microtubes based on stain-... Read More Inductors Researchers at the University of Illinois have developed a novel design of on-chip inductors using multiple turn microtubes based on stain-induced self-rolled-up nanotechnology. This technology would allow nearly 200x smaller footprint compared to conventional planar inductors while achieving significant performance improvements in all aspects. Transformers Researchers at the University of Illinois have developed a novel design of on-chip transformers using multiple turn microtubes based on strain-induced, self-rolled-up nanotechnology. This design allows a nearly 12x smaller footprint compared to conventional planar transformers, while achieving significant performance improvements. Transmission Lines Researchers at the University of Illinois have developed a novel design of on-chip transmission lines using multiple turn microtubes based on strain-induced, self-rolled-up nanotechnology. This design allows transmission lines to operate at Terahertz frequencies with significant performance improvements and reductions in interference and loss.
Magnetic Field-Guided Metal-Assisted Chemical Etching Researchers at the University of Illinois have developed a magnetic field-guided, metal-assisted chemical etching technique (h-MacEtch), which applies an external... Read More Researchers at the University of Illinois have developed a magnetic field-guided, metal-assisted chemical etching technique (h-MacEtch), which applies an external magnetic field to the existing metal-assisted chemical etching of semiconductor materials. This technology allows anisotropic formation of high-aspect-ration 3D micro and nano structures.
Extreme Miniaturization of On-Chip Filters for High Frequency or Wearable Electronics using Self-Rolled-up Membrane (S-RUM) Technology Dr. Xiuling Li from the University of IL has developed a new radio frequency filter structure using her Self-Rolled-Up Membrane (S-RUM) structure. The... Read More Dr. Xiuling Li from the University of IL has developed a new radio frequency filter structure using her Self-Rolled-Up Membrane (S-RUM) structure. The technology reduces the component size by two orders of magnitude to the state of the art technology and allows the devices to reach frequency ranges of up to 82 GHz, while retaining a comparable insertion loss. Furthermore, the performance of the device is not effected by the deformation of the substrate, and it is compatible for use in curved devices
Microscale Liquid Conductivity Sensors Conductivity of a liquid solution provides valuable information about the solution, but commercially available conductivity probes are costly and have diameters... Read More Conductivity of a liquid solution provides valuable information about the solution, but commercially available conductivity probes are costly and have diameters greater than 1cm, limiting their potential applications. Microscale thin-film liquid conductivity sensors are a novel application of semiconductor processing methodology and are capable of measuring ion concentrations in nanoliter size samples of liquid. The devices can be readily commercialized for small volume sample analysis or for in-vivo measurement in chemical or biological processes and mesoscale machines. Sensors can be fabricated as part of an integrated circuit and may be integrated with other sensors for multiparameter measurements. These robust, low-cost sensors also have potential for a wide range of commercial and industrial monitoring and control applications. Current, commercially available liquid conductivity sensors are bulky, expensive and unable to measure small sample volumes or to be used for in-vivo and in-situ applications. A newly developed surface and bulk micromachining technique enables the fabrication of low cost, robust sensor probes with temperature compensation and improved packaging on silicon wafers. From 200 to 2000 devices (depending on desired size) can be fabricated on a 4" silicon wafer, greatly reducing fabrication cost. Pt-black electroplating reduces the electrode/solution interfacial impedance, maintaining measurement accuracy while significantly reducing operation frequency. Reduction of operation frequency eliminates dependence on expensive measurement electronics. With the new process and 4-electrode measurement, sensor probes can be fabricated with tip widths much less than 100 microns. To improve device accuracy, an RTD temperature sensor can be integrated on the sensor probe tip to provide local temperature compensation. The bulk micromachining method also allows the thermal mass of the sensor to be reduced, thus improving the response time of the probe. Applications Analysis of chemical and biological fluids. In-vivo and in-situ measurements for medical testing. Controls for washing machine and dishwasher rinse cycles. Monitors to improve the performance and safety of water and ice dispensers and water purifiers. Devices for monitoring ultrapure water and measuring seawater salinity. Benefits Sensors can measure electrical conductivity in nanoliter size samples over a wide range of solution conductivity. The sensor tip accommodates an integrated temperature sensor that enhances sensor accuracy by measuring local temperature. A four-electrode design provides independent measurement of current and voltage. The device is hundreds of times smaller than commercially available conductivity probes; future devices may be miniaturized to 100 micron tip width. Sensors can be operated at very low current and power consumption and are ideal for low-power or battery-operated applications. Sensors can be driven at relatively high electric currents, with the resulting high temperature acting to de-foul the electrodes. Because of low fabrications costs, sensors can be disposable.
Dynamic Devices for Microwave Communications Dr. Eden from the University of IL has developed plasma devices that are instantaneously tuned to change their optical properties. This has applications in the microwave... Read More Dr. Eden from the University of IL has developed plasma devices that are instantaneously tuned to change their optical properties. This has applications in the microwave communications market, which has historically required many individual components that must be mechanically exchanged.
Multiplexed High Energy Lasers Dr. Eden from the University of Illinois at Urbana-Champaign has invented a new type of laser capable of creating thousands of near-perfect beams and combining them into... Read More Dr. Eden from the University of Illinois at Urbana-Champaign has invented a new type of laser capable of creating thousands of near-perfect beams and combining them into one high energy beam. This new laser has significant applications in manufacturing, defense, and research. 2015-170 Web1.png 2015-170 Web2.png
Improving 100X the sensitivity of room-temperature IR sensors Prof. Wasserman and Prof. Gong from the ECE department at the University of Illinois at Urbana-Champaign, have partnered to develop a new sensor for infrared light... Read More Prof. Wasserman and Prof. Gong from the ECE department at the University of Illinois at Urbana-Champaign, have partnered to develop a new sensor for infrared light. Combining the specific wavelength absorption of metamaterials and high sensitivity to temperature of laterally vibrating resonators, they have created new IR sensors that specifically detect target wavelengths, are 100X more sensitive than current detectors, and also are compatible to standard CMOS fabrication. These new IR sensors could be used in many different applications ranging from thermal detection, spectroscopy, or gas sensing. Publications: Gong, Songbin, Nai-Kuei Kuo, and Gianluca Piazza. "A 1.75 GHz piezoelectrically-transduced SiC lateral overmoded bulk acoustic-wave resonator." Solid-State Sensors, Actuators and Microsystems Conference (TRANSDUCERS), 2011 16th International. IEEE, 2011. Mason, Joshua, et al. "Strong coupling of molecular and mid-infrared perfect absorber resonances." Photonics Technology Letters, IEEE 24.1 (2012): 31-33. Mason, J. A., S. Smith, and D. Wasserman. "Strong absorption and selective thermal emission from a midinfrared metamaterial." Applied Physics Letters98.24 (2011): 241105 2015-141 Web.png

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