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Electronics

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A Method for the Heterogeneous Integration of III-Nitride-based Materials for the Development of Optoelectronic Devices Professor Dallesassee and coworkers from the University of Illinois has developed a method for the heterogeneous integration of III-Nitride materials on various... Read More Professor Dallesassee and coworkers from the University of Illinois has developed a method for the heterogeneous integration of III-Nitride materials on various non-native substrates. This method uses a carrier wafer for the fabrication of the III-Nitride devices, which are then transferred to a host wafer and eutectically bonded. The method takes advantage of current tooling and allows for the fabrication of optoelectronic devices embedded into a CMOS platform for full electronic controls on a common substrate, such as silicon. These technique overcomes many of the limitations currently associated with the integration of III-Nitride materials such as their sub-par thermal performance, and the high costs associated with the handling and alignment of the III-Nitride devices onto the substrate.
A Piezoelectric Micromachined Ultrasonic Transducer Using Thin-Film Lithium Niobate Professor Songbin Gong and researchers from the Department of Electrical and Computer Engineering have developed a design strategy and method for fabricating efficient... Read More Professor Songbin Gong and researchers from the Department of Electrical and Computer Engineering have developed a design strategy and method for fabricating efficient piezoelectric micro-machined ultrasonic transducer (pMUT) optimizing both ultrasonic transmitter and receiver performance in a combined platform. Currently, there are two leading material types for pMUTs : ferroelectric perovskites with solid solutions containing PbTiO3, like PZT and PMN-PT (primarily used as transducers ) and the non-ferroelectric structures such as AlN (primarily used as sensors). This balanced ultrasonic transceiver can be implemented in miniature ultrasound applications, specifically in consumer electronics for gesture recognition, biometric sensing and occupancy sensing.
Miniature Mercury Lamp Researchers from the University of Illinois, along with their collaborators at Eden Park Illumination, have developed a new miniaturized lamp for uses in atomic clocks and... Read More Researchers from the University of Illinois, along with their collaborators at Eden Park Illumination, have developed a new miniaturized lamp for uses in atomic clocks and environmental sensors. These atomic clocks are highly useful in autonomous vehicles due to the precision and accuracy they provide. While most lamps use direct electron impact, this new lamp takes advantage of atomic excitation transfer to increase the efficiency of the lamp. This process reduces the size, and therefore the cost, of producing the lamp. Utilizing smaller lamps will allow for atomic clocks to be more easily integrated into commercial vehicles. Several iterations of the Hg+ lamp have been tested and can be made as small as 0.25 cm3.
Property-driven Automatic Generation of Reduced-ISA Hardware Dr. Rakesh Kumar and his team have developed a new system and tool to analyze logic circuits and find opportunity to automatically optimize them. This technology... Read More Dr. Rakesh Kumar and his team have developed a new system and tool to analyze logic circuits and find opportunity to automatically optimize them. This technology automatically identifies unused instructions from microprocessors that an application is guaranteed not to exercise, eliminates these components and optimizes the design to reduce their cost, area and power requirement. This system uses a combination of techniques that differ from prior methods and leads to improved results. Instead of adding instructions to a specific design, it automatically removed unused ones and generates enhanced hardware from arbitrary designs.
Ultra-flexible 2D Heterostructures for MEMS and Optoelectronic Applications Researchers at the University of Illinois have developed ultra-flexible heterostructures made from 2D layers of van der Waals bonded materials. The heterostructures retain... Read More Researchers at the University of Illinois have developed ultra-flexible heterostructures made from 2D layers of van der Waals bonded materials. The heterostructures retain the optoelectronic properties of their constituent layers, but offer tunable mechanical properties which can include flexibility rivaling that of lipid bilayers. Applications for this technology include MEMS devices and flexible, stretchable, and conformal circuitry, including reconfigurable 2D devices and folded/curved/crumpled nanostructures.
Stretchable and Flexible Optoelectronics from Crumpled Two-Dimensional Material Heterostructures Researchers from the University of Illinois have developed a platform for stretchable + flexible optoelectronics that offer consistent performance in stretched vs. non-... Read More Researchers from the University of Illinois have developed a platform for stretchable + flexible optoelectronics that offer consistent performance in stretched vs. non-stretched mode. The platform, which features stacked layers of two-dimensional materials that are crumpled or wrinkled, can enable new designs and manufacturing methodologies for devices that offer both toughness and malleability at scales as small as nanometers.
3D Multi-stack Nanowire and Nanosheet High Electron Mobility Transistors via Ultra-Wide Bandgap (UWBG) Materials Researchers at the University of Illinois have developed a three-dimensional high electron mobility transistor (HEMT) architecture that utilizes ultra-wide bandgap (UWBG)... Read More Researchers at the University of Illinois have developed a three-dimensional high electron mobility transistor (HEMT) architecture that utilizes ultra-wide bandgap (UWBG) materials. These structures and devices can be used for high-power, high-frequency applications, where they can confer an order of magnitude higher performance than wide bandgap (WBG) devices, including simultaneously achieving 10x higher power density while operating at frequencies as high as 120 GHz.
DiAG A new processor architecture that increases speedup and decreases energy consumption Researchers at the University of Illinois Urbana-Champaign have developed a processor architecture that allows for greater efficiency in computing power and energy... Read More Researchers at the University of Illinois Urbana-Champaign have developed a processor architecture that allows for greater efficiency in computing power and energy consumption. The architecture exploits parallelism through thread pipelining and an out-of-order loop system. This process is possible by utilizing more processing elements in the system. This method does create extra cost and is essentially a cost for efficiency trade-off. The system can be used in a variety of embedded systems such as CPUs and GPUs. The decrease in energy consumption can also be applied to servers and other large processing units that consumer a lot of energy and in the process and lot of heat.
Direct Printing of Ultra-Stretchable Supercapacitors A promising direct printing method that combines new materials for hybrid, ultra-stretchable supercapacitors. Supercapacitors can quickly discharge making them ideal for... Read More A promising direct printing method that combines new materials for hybrid, ultra-stretchable supercapacitors. Supercapacitors can quickly discharge making them ideal for applications such as electric vehicles, ships and trains. These novel materials are lighter weight and have the potential perform better than current supercapacitor technology. These combination of materials can be fabricated in a wide array of shapes and sizes, including thin films and fibers; increasing their electrochemical and mechanical properties such as better electrical conductivity, capacity and durability.
Simultaneous Imaging of Polarized and Visible Light Using a Single Chip Capturing polarized and visible light simultaneously is usually achieved by either rotating filters that reduce frame rate and need a static image or using an array of... Read More Capturing polarized and visible light simultaneously is usually achieved by either rotating filters that reduce frame rate and need a static image or using an array of sensors that must be aligned and can be bulkily and expensive. These issues are solved by Dr. Viktor Gruev's invention of a single chip that can detect both kinds of light simultaneously with high resolution and in real time. This sensor can detect 12 bands of visible light and 3 bands of polarized light. Because data is gathered in real time and does not require rotating filters, this sensor has applications in military surveillance, particularly in hazy conditions such as fog or underwater where polarized imaging can reduce background scattering information. Additionally, this sensor can be used in image-guided surgery, such as tumor removal used in combination with injected dyes that bind to cancerous cells that respond to different kinds of light.

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