Electronics

Latest Innovations

Ultrasoft Slip-mediated Bending in Few-layer Graphene

This technology leverages the bending stiffness and super lubricity of few-layer materials to create ultra-flexible 2D materials with tunable electronic properties....

High Resolution Distributed Sensor

Inventors from the University of Illinois have developed novel phase-separated optical fibers for use in a distributed sensor. These phase-separated optical fibers have...

Energy Efficient Nanoscale Capacitor

Dr. Alexey Bezryadin, with his research group, has developed a dielectric capacitor that provides 200 J/g of storage density. By injecting and trapping charges within a...

Method To Produce Nanoscale 3D Porous Silicon Patterns and Applications

This method of forming a nanoscale three-dimensional pattern in a porous semiconductor includes providing a film comprising a semiconductor material and defining a...

Improved Method for Fabricating a S-RuM Inductor with High Q

This is a new method for fabricating a self-rolled-up membrane (S-RuM) membrane. The invention allows for the fabrication of high-quality-factor milliTesla- and Tesla-...

III-V Metal Assisted Chemical Etching to Produce High Aspect Ratio III-V Semiconductor Nanostructures 

This technology is a new method for creating high aspect ratio III-V semiconductor nanostructures. Unlike currently used commercial technologies, this method does not...

Defect Resistant Red LEDs

Standard red LEDs suffer from rapid degradation and low efficiency, which becomes increasingly poor at smaller dimensions. Dr. Lee’s novel LED design integrates InP...

Eliminating Oxygen Vacancies in Thin-Film Metal Oxides through a Liquid Environment

Dr. Seebauer from the University of Illinois has developed a method to eliminate oxygen vacancy defects in thin-film metal oxides. The novel method of a liquid environment...

A Method for the Heterogeneous Integration of III-Nitride-based Materials for the Development of Optoelectronic Devices

 

Professor Dallesassee and coworkers from the University of Illinois has developed a method for the heterogeneous integration of III-Nitride materials on various...

A Piezoelectric Micromachined Ultrasonic Transducer Using Thin-Film Lithium Niobate

Professor Songbin Gong and researchers from the Department of Electrical and Computer Engineering have developed a design strategy and method for fabricating efficient...

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