Engineering

Latest Innovations

High bandwidth Data/Power Transfer Using Sound Waves

 

Researchers from the University of Illinois have developed a technology that enables ultra high bandwidth data communication as well as power transfer over short...

Feedforward Active Filter for Output Ripple Cancellation in Switching Power Converters

 

This innovative system combines two remarkable technologies, power control and ripple cancellation, in a cost-effective package. This system optimizes the...

Lower Cost Pump-Probe Fluorescence Microscope with High Spatial Resolution

 

This new pump-probe fluorescence microscope provides efficient, high-resolution, lifetime imaging of ultrafast fluorescence phenomena. It provides an economical...

Buried Tunnel Contact Junction For Better Performance With Less Power

In many semiconductor light emitting devices, minimizing the volume of the p-type material is desirable. This technology involves burying a tunnel contact junction...

Highly Efficient Microcooling/Heating Device

 

A compact active vapor compression cycle heat transfer device. The device of the invention includes a flexible diaphragm serving as the compressive member in a...

Metal-Assisted Etching For Improved Porous Semiconductors

 

The invention is a novel method for manufacturing porous semiconductors, including silicon (Si), gallium nitride (GaN) and silicon carbide (SiC). The method...

Microscale Liquid Conductivity Sensors

 

Conductivity of a liquid solution provides valuable information about the solution, but commercially available conductivity probes are costly and have diameters...

Highly Reflective Interface for Distributed Bragg Reflectors (DBRs)

 

Distributed Bragg Reflectors (DBRs) are a fundamental component of optical devices requiring an optical gain, such as various types of semiconductor lasers....

Tunnel Coupling Layer for Efficient Quantum Dot Lasers

 

A major problem with quantum dot (QD) lasers is the stochastic nature of QD structures, the lack of uniformity, the insufficient QD density, and the poor QD-to-QD...

Innovative and Versatile System for Measurement Of Thickness, Uniformity, Delamination, and Integrity of In Situ Thin Films

 

This technology is a new method for measuring the thickness and integrity of thin films (nanometer to micron thickness), primarily those deposited on semiconductor...

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