Electronics

Latest Innovations

Patterning Methods for Stretchable Structures

 

Described herein are processing techniques for fabrication of stretchable and/or flexible electronic devices using laser ablation patterning methods. The laser...

Mirror Arrays for Maskless Photolithography and Image Display

 

This invention is a class of micromirrors with high reflectivity dielectric layer coated on top of micromirror that can be tuned to allow transparency or...

Highly Controllable ICP Low Rate Etching of Gallium-Based III-V Semiconductor Materials

 

A method of plasma etching Ga-based compound semiconductors includes providing a process chamber and a source electrode adjacent to the process chamber. The...

A High Speed, High-Precision Micro and Nano-Scale Cutting Machine

 

Photolithography, a method for manufacturing grooves into surfaces of silicon primarily for the design and manufacture of electronics, has certain limitations when...

Self-Aligning Mechanism for Uniaxial Tests at Micro-Nano Scale and Method for in situ Mechano-Electrical Measurements of Micro-Nano Scale Specimens

 

Current methods of performing tensile tests on micro-nano scale material samples have an inherent flaw, namely that true uniaxial loads are difficult to achieve....

Self-Rolled-UP Tube Base Vertical Coupler for 3D Monolithic Photonic Integration

 

Researchers have developed a new self-rolled-up tube based vertical photonic coupler. The technology will open up new design perspectives for semiconductor...

Cobalt Precursors For Formation of Cobalt or Cobalt-Containing Material

 

Chemical vapor deposition (CVD) of cobalt requires a cobalt precursor that can be easily vaporized, leaving high-purity cobalt on a surface while causing no...

Multiplexed Sensor Arrays for Micro/Nanofluidic Networks

 

The ability to increase the functionality and complexity of micro/nanofluidic devices is currently limited by the capacity to accurately detect the position of...

Superconformal Chemical Vapor Deposition

 

Manufacturers can not achieve superconformal (bottom-up) filling of high aspect ratio features by a modified chemical vapor deposition method. The CVD precursor...

Long-Range Energy Transfer via Quenching Surfaces for the Detection of Biomolecular Binding and Un-Binding

 

 

This technology is a rapid, simple and sensitive method for detecting the binding or unbinding of biomolecules using a silicon wafer. It is a novel method...

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