Dr. Kim from the University of Illinois has developed a 2-part dry adhesive which has an electrically conductive layer and an adhesive layer. The electrically conductive layer is made from carbon black and shape memory polymer (SMP), while the adhesive layer is made of SMP. Applying voltage to the adhesive strips allows the SMP to bond to both curved and flat surfaces. Re-application of voltage allows the adhesive to be removed. This technology represents improvements over current dry adhesives because of the internal heating capability, reversibility of shape before and after bonding and reusability.