Dr. Krogstad from the University of IL has developed a high surface area to volume nickel foam that is structurally stable at extremely high temperatures.
Submicron scale non-refractory microstructured metals suffer from poor thermal stability because their large surface area to volume ratio promotes sintering and a consequent loss of structure and properties. The aluminization process applied in the current invention produces a material that is stable up to 1000°C, allowing for use in high temperature applications.