This technology is an efficient process for assembling large arrays of three-dimensional, hinged micro structures for micro electromechanical systems (MEMS) applications. Using a single electromagnet for actuation, this new method saves chip space as well as actuates large arrays of devices in parallel. It makes fabrication of MEMS devices more reliable and simple by eliminating the need for biasing several actuators and not requiring a constant source of energy for actuation.

Ice formation and other surface contaminants frequently endanger aircraft by reducing their level of performance and maneuverability. This new sensing device improves the chances for aircraft pilots or autopilots to react, change flight controls to adjust to the situation, and avert accidents. Similar sensing systems exist; however, this system is a more efficient and better safeguard. This system uses a sensor that measures the effects of the contaminant on the lifting surfaces, such as the wings of the aircraft, and relays this information to the pilot in real time.

Integrated wireless communications systems require tunable capacitors that have a wide tuning range, low loss, and monolithic integration. This new MEMS tunable capacitor perfectly meets those needs.

This technology is an algorithm designed to enhance power allocation in multichannel, orthogonal frequency division multiplexed (OFDM) telecommunications systems that use discrete multitone (DMT) protocol, among others. DMT includes all asymmetrical digital subscriber line (ADSL) systems and residential DSL systems. The algorithm serves to improve the achievable data rate or the signal-to-noise ratio (SNR), reducing errors in the transmission, and can be used for any OFDM system where the SNR varies across channels.

This technology is a method of fabricating an oxide layer on the surface of a high-temperature (high Tc) superconductor. The oxide layer passivates the superconductor, preventing degradation via air and moisture and eliminating the need to store materials at low temperatures in controlled atmospheres. The oxide coating also permits higher resolution measurements of the electronic structure at the superconductor surface than was previously possible. The technology is useful in forming improved tunnel junctions and potentially Josephson tunnel junctions.

This technology-plastic deformation magnetic assembly (PDMA)-is an innovative, proven, patent-pending method for vertically assembling inexpensive, high-performance coil inductors that take up a small area on the chip and reduce noise due to substrate loss. University researchers developed this novel assembly method for integrating coil inductors into radio frequency (RF) circuits. PDMA essentially stands the coil inductors vertically on end so that they take up far less space on the chip than planar inductors.

This technology is a suite of four inventions relating to microelectronic logic circuits and the reduction of power and/or time requirements. The suite comprises: (1) parallel dynamic logic (PDL) and speed-enhanced skewed static logic (SSS); (2) skewed static logic (S2L) with topology-dependent dual threshold voltage (Vt); (3) reduced swing-clock double-edge triggered flip-flop; and, (4) low-power, small-area, small jitter, delayed lock-loop (DLL)-based clock generator. Collectively, these technologies serve to reduce power consumption and/or enhance performance.

Group III-V semiconductor devices have many advantages over silicon-based semiconductors, including speed and the ability to produce optical emissions. For this reason, they are being widely used in optoelectric devices. This technology offers a new method for producing low-resistance electrical contacts on Group III-V materials used in electrical and optical devices. The new method produces the lowest known resistivity PdGe contacts on gallium arsenide (GaAs).