This novel method for depositing metal films on a polymer surface significantly increases the adhesion strength of metal-polymer interfaces by providing mechanical interlocking on a microscopic scale.

These innovative organic materials offer many of the optical performance characteristics of inorganic materials. However, these organic materials have few of the drawbacks inherent in the processing of comparable inorganic materials. Unlike inorganic materials capable of similar performance, this technology is exceptionally easy and considerably less expensive to process.

NatOx is a well-known, proven, and patented technology that enables the formation of high-quality oxide layers on compound semiconductors, leading to improved performance and lower costs for optoelectronic and microelectronic devices. Oxides provide crucial functions in semiconductors, including masking, passivation, isolation, and other more active functions. Although long available for silicon-based devices, a native (as opposed to deposited) oxide was not available for Group III-V semiconductors.

This technology is a new method for measuring the thickness and integrity of thin films (nanometer to micron thickness), primarily those deposited on semiconductor substrates, although it is broadly applicable to many material systems. It provides direct measurements, is relatively inexpensive, and can be implemented inline with an existing process. An invaluable series of applications exist for determination of film uniformity, extent of film lamination, and defect detection.

This invention is a novel, out-of-plane, hot-wire anemometer and a microfabrication method for producing it. Its composition and innovative production process enable the sensing element to be raised out of the plane of the substrate and thus arrays of sensors can be easily formed. Out-of-plane sensors provide greater sensitivity by virtue of higher thermal isolation and out-of-plane sensor arrays enable true three-dimensional representations of the flow.

This simple, inexpensive sensor detects the end-point thickness during parylene deposition with greater accuracy than conventional methods. It reduces production costs and enables the use of parylene coatings in applications that require a higher precision of thickness than is currently available. This disposable sensor is fabricated using a low-cost micromachining technology and can be easily implemented in commercial parylene deposition systems. Use of the sensor requires only the replacement of a viewport by a new flange with electrical feedthroughs and mechanical supports.

This technology is a new experimental method and device for the on-chip, uni-axial tensile testing of freestanding thin films, with virtually no restriction on film thickness (nanometers to micrometers). The method obviates the use of separate gripping mechanisms, ensures virtually perfect specimen alignment, and accurately calibrates loading of the specimen with required force resolution.

Developed by researchers at the University of Illinois at Urbana-Champaign, this new fiber optic technology suppresses stimulated Brillouin scattering (SBS) in fiber laser technologies,