Various methods are available for cooling high-heat flux electronic, optical and radiological devices. However, the miniaturization and breakthrough developments for these components are severely hindered by the need to cool them at heat fluxes on the order of 1 kW/cm2. There are many different approaches to cooling these devices: conduction and heat spreading, air cooling, piezo fans, synthetic jet cooling, nanolightning, liquid jet cooling (including liquid metal jets), heat pipes, cold plates, immersion cooling, micro-channel heat sinks and spray cooling.