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Latest Innovations
Mirror Arrays for Maskless Photolithography and Image Display This invention is a class of micromirrors with high reflectivity dielectric layer coated on top of micromirror that can be tuned to allow transparency or... Read More This invention is a class of micromirrors with high reflectivity dielectric layer coated on top of micromirror that can be tuned to allow transparency or reflectivity of UV or Visible light to meet the needs of the application. Also disclosed is a top-down fabrication process for the assembly of coated micromirrors using polymer structural material. Includes additional features & methods for: phase shift mask, sharp turn off, flexible micromirror arrays, and thermal compensation.
An Internally Heated Shape Memory Polymer Dry Adhesive Dr. Kim from the University of Illinois has developed a 2-part dry adhesive which has an electrically conductive layer and an adhesive layer. The electrically... Read More Dr. Kim from the University of Illinois has developed a 2-part dry adhesive which has an electrically conductive layer and an adhesive layer. The electrically conductive layer is made from carbon black and shape memory polymer (SMP), while the adhesive layer is made of SMP. Applying voltage to the adhesive strips allows the SMP to bond to both curved and flat surfaces. Re-application of voltage allows the adhesive to be removed. This technology represents improvements over current dry adhesives because of the internal heating capability, reversibility of shape before and after bonding and reusability.
Parallel Interleaved Inverters for Efficient DC-AC Power Conversion and Low Distortion Current Output Researchers from the University of Illinois have developed a new method to reduce the distortion in the output c urrent of multiple inverters used in DC to AC... Read More Researchers from the University of Illinois have developed a new method to reduce the distortion in the output c urrent of multiple inverters used in DC to AC power conversion. This new technology helps to reduce the size and cost of the power electronic components currently used in power conversion. Also, this method is scalable and so this concept can be implemented on micro-scale systems.
Virtual Oscillator Control of Power Electronic Inverters Researchers from the University of Illinois have developed a device that will synchronize the output of DC/AC inverters for the purpose of combining them into a... Read More Researchers from the University of Illinois have developed a device that will synchronize the output of DC/AC inverters for the purpose of combining them into a micro-grid. The system would instantly react to power supplies suddenly connecting or disconnecting without ever allowing any deviation from the present perameters. The benefits over current systems is the lack of communication needed, and the impossibility of dangerous surges while adjusting to sudden changes.
String Protection for Photovoltaic Cells Hot-spotting is a common problem in solar panel configurations that can potentially damage photovoltaic cells by forcing the conduction of reverse current in shaded or... Read More Hot-spotting is a common problem in solar panel configurations that can potentially damage photovoltaic cells by forcing the conduction of reverse current in shaded or dysfunctional cells. The proposed invention offers a solution at the modular level by incorporating the photovoltaic panel into an open circuit to prevent hot-spotting. As a result, other panels in the photovoltaic string will remain functional under all adverse conditions. Researchers from the University of Illinois have developed a method and apparatus to protect solar cells from hot spotting and damage resulting from arc faults. This device would also provide a way to shut off the solar array remotely. By preventing the damage caused by hot spotting and arc faults this device increases the longevity of solar arrays. It also reduces the risk of fire and provides a remote way to cut the power in cases of emergency.
Water Resistant Metal-Organic Frameworks The construction of nanoporous metal-organic frameworks (MOF) by copolymerization of organic molecules with metal ions has received widespread attention in recent... Read More The construction of nanoporous metal-organic frameworks (MOF) by copolymerization of organic molecules with metal ions has received widespread attention in recent years. These materials are thermally robust and, in many cases, have high porosity. However, recent experiments have shown that some MOFs are not stable when exposed to >4% water, limiting their usefulness. Coordination bonding overcomes this limitation, requires mild conditions to create frameworks, and brings myriad choices of building blocks. Trifluoromethoxy group, which has been proved on most water repellent polymers and coating materials, reduces the water damage on MOF structures. A water resistant MOF, namely, ZnMOF3 is obtained through both solvothermal synthesis and microwave assisted solvothermal synthesis. It has a comparable vapor adsorbtion capacity with the commonly used MOFs, but does not adsorb moisture at 70 C. In addition, exposing ZnMOF3 to boiling water vapor for one week does not result in any dramatic X-ray powder pattern change. ZnMOF3 is a potential adsorbent in many industrial applications such as air adsorption.
Poly(dimethylsiloxane)-based Microfluidic Devices: Sensors and Fuel Cells A microfluidic electrochemical reactor includes an electrode and one or more microfluidic channels on the electrode, where the microfluidic channels are covered... Read More A microfluidic electrochemical reactor includes an electrode and one or more microfluidic channels on the electrode, where the microfluidic channels are covered with a membrane containing a gas permeable polymer. The distance between the electrode and the membrane is less than 500 micrometers. The microfluidic electrochemical reactor can provide for increased reaction rates in electrochemical reactions using a gaseous reactant, as compared to conventional electrochemical cells. Microfluidic electrochemical reactors can be incorporated into devices for applications such as fuel cells, electrochemical analysis, microfluidic actuation, pH gradient formation.
Highly Controllable ICP Low Rate Etching of Gallium-Based III-V Semiconductor Materials A method of plasma etching Ga-based compound semiconductors includes providing a process chamber and a source electrode adjacent to the process chamber. The... Read More A method of plasma etching Ga-based compound semiconductors includes providing a process chamber and a source electrode adjacent to the process chamber. The process chamber contains a sample comprising a Ga-based compound semiconductor. The sample is in contact with a platen which is electrically connected to a first power supply, and the source electrode is electrically connected to a second power supply. The method includes flowing SiCl.sub.4 gas into the chamber, flowing Ar gas into the chamber, and flowing H.sub.2 gas into the chamber. RF power is supplied independently to the source electrode and the platen. A plasma is generated based on the gases in the process chamber, and regions of a surface of the sample adjacent to one or more masked portions of the surface are etched to create a substantially smooth etched surface including features having substantially vertical walls beneath the masked portions.
Hybrid Semiconductor 3D Nanoscale Patterning Method Using Superionic Solid State Stamping (S4) and Metal Assisted Etching (MacEtch) Various high aspect ratio semiconductor 3D nanostructures have begun to have profound effect on the design and performances of many types of devices, including... Read More Various high aspect ratio semiconductor 3D nanostructures have begun to have profound effect on the design and performances of many types of devices, including batteries, solar cells, detectors and thermoelectrical systems. Photolithography is typically used for the fabrication of these nanostructures, which is an extremely expensive technique, especially for large area applications. This invention provides a new method for processing three dimensional (3D) periodic nanostructure patterns in semiconductor materials including Si, III-V, II-VI and other types of semiconductors. Details This invention describes the fabrication technique used to manufacture 3D periodic nanostructure patterns in semiconductor materials. The technique is non-lithographic and combines two fabrication techniques; superionic solid state stamping (S4) and metal assisted etching (MacEtch). S4 is a unique electrochemical stamping process, used to pattern artibrary nanoscale shapes in metallic materials (down to 15nm range) using a solid electrolyte stamp in which metal ions are immobilized. MacEtch is then used to selectively remove portions of the semiconductor, assisted by metal catalyst under a wet etching environment. Using these two methods together opens up the nanostructure world for use in large area applications. Applications 3D nanostructure fabrication will prove useful in the areas of: Batteries Photovoltaics Thermoelectrics Benefits Powerful hybrid fabrication technique (top-down approach) Fast (30 sec to a few minutes, depending on depth desired) Performed at room temperature Non-lithographical Low-Cost Scalable Efficient Fabricate both linear and annular patterns (can make circular patterns) High aspect ratios (resolution like no other technique, features down to 15nm range)
Gas Purification Device with Liquefaction of Dilute Gas Components Many manufacturing processes currently emit large quantities of gas effluent into the atmosphere or dispose of by techniques such as thermal oxidation or bio-... Read More Many manufacturing processes currently emit large quantities of gas effluent into the atmosphere or dispose of by techniques such as thermal oxidation or bio-filtration (which both consume auxiliary fuel and produce CO2). These are usually carrier gases that contain dilute concentrations of organic gas (contaminants). This invention is a new device process for separating dilute gas(es) (e.g. organic gases) from gas streams for reuse as a liquid or other useful purposes (e.g. auxiliary fuel or chemical manufacturing). The invention provides gas purification methods and systems for the recovery and liquefaction of low boiling point organic and inorganic gases, such as methane, propane, CO.sub.2, NH.sub.3, and chlorofluorocarbons. Many such gases are in the effluent gas of industrial processes and the invention can increase the sustainability and economics of such industrial processes. In a preferred method of the invention, low boiling point gases are adsorbed with a heated activated carbon fiber material maintained at an adsorption temperature during an adsorption cycle. During a low boiling point desorption cycle the activated carbon fiber is heated to a desorption temperature to create a desorption gas stream with concentrated low boiling point gases. The desorption gas stream is actively compressed and/or cooled to condense and liquefy the low boiling point gases, which can then be collected, stored, re-used, sold, etc. Systems of the invention include an active condensation loop that actively cools and/or compresses a desorption gas stream from said vessel to liquefy low boiling point gases. Applications Packaging Material Gas purification (O2/N2 Separation, Ethane/Butane/Propane Separation) Chemical Manufacturing Petrochemical Printing & Painting Natural Gas Benefits Converts waste gas stream into 1) useful liquid (close to 100% pure) and/or 2) purified gas stream Generate auxiliary fuel by recycling purified carrier gas Closed loop system (reduces operating cost, energy, and material consumption) Reduces CO2 gas production (thousands of metric tons per year) Uses gas, not vapor (therefore boiling point is not an issue) To license the entire Vapor Phase Removal and Recovery System portfolio, click here.

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